ElectroMechanical Design Engineer: MicroElectronics

Basic Qualifications

O.D. Secret level clearance or be able to obtain one.

Working knowledge of CREO and Windchill.

Geometric Dimensioning and Tolerancing, and tolerance stack‑up analysis.

Packaging design experience.

Hardware design experience.

Must be a U.S. citizen.

You will be the Electro Mechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2‑D/3‑D heterogeneous packaging concepts, integrating thin film, semiconductor and high‑performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

As the Electro Mechanical Design Engineer you will design, prototype and test cutting‑edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands‑on experience with emerging semiconductor manufacturing processes and translating them into flight‑qualified hardware.

• Conceiving and modeling 2‑D/3‑D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross‑functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules and a comprehensive benefits package that invests in your future and security.

This position is in Orlando. Discover more about our Orlando, Florida location.

Must be a U.S. citizen. The position is located at a facility that requires special access; the selected candidate must be able to obtain a secret clearance.

• Experience with Zuken E3 and Mentor
• CCA design and development
• IDX File transfer
• Flex design
• Cable and harness design
• Micro electronics experience

Part‑time remote telework:
The employee selected for this position will work part of their schedule remotely and part at a designated Lockheed Martin facility. The specific weekly schedule will be discussed during the hiring process.