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Electro Mechanical Engineer Sr Stf

Job in Orlando, Orange County, Florida, 32801, USA
Listing for: Lockheed Martin
Full Time position
Listed on 2026-08-29
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Electrical Engineering, Test Engineer
Salary/Wage Range or Industry Benchmark: 129000 - 239600 USD Yearly USD 129000.00 239600.00 YEAR
Job Description & How to Apply Below

Electro-Mechanical Design Engineer

You will be the Electro-Mechanical Design Engineer for the Advanced Electronics Packaging team. Our team pioneers 2-D/3-D heterogeneous packaging concepts, blending thin-film, semiconductor, and high-performance thermal-management technologies to deliver next-generation electronic systems for aerospace and defense missions.

What You Will Be Doing As the Electro-Mechanical Design Engineer you will design, prototype, and test cutting-edge packaging solutions while partnering with electrical, systems, test, and product-design engineers. You'll work side-by-side with Lockheed Martin's senior Advanced Packaging SME, gaining hands-on experience with emerging semiconductor processes and turning them into flight-qualified hardware. Your responsibilities will include:

  • Conceiving and modeling 2-D/3-D heterogeneous package architectures that meet size, weight, power, and reliability targets.
  • Developing detailed mechanical and electrical designs for thin-film interconnects, semiconductor dies, and advanced thermal-management features.
  • Creating and executing test plans to validate electrical performance, thermal behavior, and mechanical integrity of prototypes.
  • Performing failure analysis and iterating designs based on test data, simulations, and manufacturing feedback.
  • Preparing comprehensive design documentation—including drawings, BOMs, specifications, and verification reports.
  • Collaborating with cross-functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
  • Mentoring junior engineers and supporting the Advanced Packaging SME with knowledge transfer and technical guidance.
  • Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
  • Supporting technology-readiness reviews and contributing to risk-assessment activities for new packaging concepts.
  • Traveling as needed to support supplier visits, test campaigns, and program milestones.

Why Join Us Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security.

Further Information About This Opportunity:
This position is in Orlando. MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Basic Qualifications:

  • Minimum 10 years of professional experience in Electromechanical Engineering or related discipline with a Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university or
  • Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree

Desired

Skills:

  • Advanced Packaging Architecture:
    Experience with System-on-Chip (SOC) / Multi-Chip Package (MCP) solutions and 2D/3D heterogeneous integration concepts.
  • Validation & Test Integration:
    Familiarity with Application-Specific Integrated Circuit (ASIC) verification and validation testing requirements at the circuit card level.
  • Trade Studies & Optimization:
    Demonstrated ability to perform comprehensive design trade studies evaluating cost, weight, thermal packaging, and power benefits.
  • Systems Engineering Tools:
    Familiarity with Model-Based Systems Engineering (MBSE) methodologies and CAMEO software

Pay Information Full-Time Salary Range: $129000.00 - $239600.00 At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.

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