Electro Mechanical Engineer Sr Stf

Electro‑Mechanical Design Engineer

You will be the Electro‑Mechanical Design Engineer for the Advanced Electronics Packaging team. Our team pioneers 2‑D/3‑D heterogeneous packaging concepts, blending thin‑film, semiconductor, and high‑performance thermal‑management technologies to deliver next‑generation electronic systems for aerospace and defense missions.

As the Electro‑Mechanical Design Engineer you will design, prototype, and test cutting‑edge packaging solutions while partnering with electrical, systems, test, and product‑design engineers. You’ll work side‑by‑side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands‑on experience with emerging semiconductor processes and turning them into flight‑qualified hardware.

• Conceiving and modeling 2‑D/3‑D heterogeneous package architectures that meet size, weight, power, and reliability targets.
• Developing detailed mechanical and electrical designs for thin‑film interconnects, semiconductor dies, and advanced thermal‑management features.
• Creating and executing test plans to validate electrical performance, thermal behavior, and mechanical integrity of prototypes.
• Performing failure analysis and iterating designs based on test data, simulations, and manufacturing feedback.
• Preparing comprehensive design documentation—including drawings, BOMs, specifications, and verification reports.
• Collaborating with cross‑functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME with knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology‑readiness reviews and contributing to risk‑assessment activities for new packaging concepts.
• Traveling as needed to support supplier visits, test campaigns, and program milestones.

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here.

This position is in Orlando.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

• Minimum 10 years of professional experience in Electromechanical Engineering or related discipline with a Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university

or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree

• Microelectronics & Layout Design:
  Proven experience in microelectronics design, including Circuit Card Assembly (CCA) / Printed Wiring Board (PWB/PCB) design, and flex circuit design.
• Interconnect Engineering:
  Experience with cable harness concepts for subsystem interfaces and generating detailed functional wiring diagrams.
• High-Speed Systems:
  Familiarity with high-speed applications and associated PWB layout constraints.
• Requirements Management:
  Experience capturing, flowing down, and deriving technical requirements for complex electromechanical designs.
• Component Selection:
  Experience managing parts, materials, and process selections for electronic hardware

• Advanced Packaging Architecture:
  Experience with System-on-Chip (SOC) / Multi-Chip Package (MCP) solutions and 2D/3D heterogeneous integration concepts.
• Validation & Test Integration:
  Familiarity with Application-Specific Integrated Circuit (ASIC) verification and validation testing requirements at the…