Director of Electrical Engineering

Overview

Vous serez responsable de l’équipe d’ingénierie électrique pour une startup de neurotechnologie de nouvelle génération et d’interfaces cerveau‑ordinateur (BCI) à stade de furtivité, construisant une plateforme d’interface neuronale alimentée par l’IA. Dans ce rôle, vous dirigerez l’architecture électrique portable, de la schématisation à la production, afin de mettre sur le marché un dispositif hautement intégré de prochaine génération. La plateforme combine caméras, microphones audio spatiaux, capteurs EEG, connectivité Wi‑Fi/BLE et gestion de l’énergie avancée sur un PCB flexible intégré dans une casquette en textile, nécessitant une expertise approfondie en conception de systèmes portables compacts, intégrité du signal et développement de matériel prêt à la production.

• Own the electrical architecture across the platform — compute partitioning, sensor integration, power, RF, and SI/PI.
• Lead schematic and PCB design for flex and rigid‑flex multi‑island layouts, and own SI/PI sign‑off across every revision.
• Architect the power tree — battery management, multi‑rail regulation, USB‑C charging, and dynamic power budgeting.
• Own RF and wireless electrical design — antenna diversity, body‑proximity tuning, and Wi‑Fi/BLE coexistence.
• Define and validate every communication bus on the platform — parallel and serial sensor interfaces, audio buses, inter‑MCU links.
• Drive part selection, benchmarking, and BOM ownership across MCUs, PMICs, RF SoCs, and the full electrical BOM, with second‑source strategy.
• Lead bring‑up at the electrical layer — own SI, PI, power, and bus‑level debug, and unblock firmware and subsystem leads on the way.
• Drive the design through DFM and qualification gates with our CMs, and ship the product by end of year.
• Build and lead the EE team as we scale from early test batches to production volumes.

• 10+ years designing complex consumer hardware, with at least one shipped product (wearable, audio, mobile, or comparable).
• Deep mixed‑signal expertise across MCU systems, sensor AFEs, audio DSPs, image sensor interfaces, RF/wireless, and battery/charging.
• Strong SI/PI discipline with hands‑on sign‑off on flex and rigid‑flex multi‑island designs.
• Direct experience architecting and validating multi‑MCU communication buses — parallel and serial interfaces, inter‑processor links.
• Direct experience driving part selection, BOM ownership, and second‑source strategy on a shipped product.
• Track record of leading hardware bring‑up and partnering closely with firmware on debug.
• Comfortable owning overseas CM relationships and driving DFM, DFT, and DFA from prototype through volume.

• EEG, ECoG, or other biopotential systems — especially high‑channel‑count or dense sensor arrays.
• Custom ASIC bring‑up, silicon co‑design, or in‑array readout architectures.
• RF design for body‑worn antennas and multi‑radio coexistence.
• Founding engineer or lead‑level experience at an early‑stage hardware company.