Principal Packaging Engineer

What We Need

A Senior Packaging Engineer responsible for architecting and delivering advanced multi‑die IC packages for high‑performance AI accelerators. This role focuses on package architecture, substrate design, manufacturability, and vendor engagement.

• Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
• Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
• Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
• Perform high‑speed signal escaping, routing and power distribution network design.
• Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
• Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system‑level needs.
• Evaluate emerging packaging technologies and drive adoption for next‑generation products.
• Support package‑level bring‑up, failure analysis, debug, and qualification.

• B.S./M.S. in Electrical Engineering or related field.
• Experience with multi‑die package design and UCIe (AP/SP) integration.
• Understanding of substrate materials, stack‑ups, and mechanical constraints.
• Familiarity with SI/PI concepts to collaborate effectively with electrical teams.
• Experience managing packaging subcontractors.
• Experience interfacing with TSMC/OSAT for bumping and packaging options.
• Knowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus.

Target base salary for this role is $180,000–$240,000 per year + meaningful equity + benefits + 401k. Our salary ranges are determined by role, level, experience, and location.

We are an equal opportunity employer. We value a range of perspectives and experiences and make employment decisions based on merit and business needs. We do not discriminate on the basis of legally protected characteristics.