Senior Multi‑Die IC Packaging Architect
Job in
Palo Alto, Santa Clara County, California, 94306, USA
Listed on 2026-07-13
Listing for:
Entrada Ventures
Full Time
position Listed on 2026-07-13
Job specializations:
-
Engineering
-
Design & Architecture
Job Description & How to Apply Below
Entrada Ventures is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators, focusing on package architecture, substrate design, manufacturability, and vendor engagement.
You will define substrate stackups, bump and ball maps, interposer requirements, high‑speed routing, and collaborate with TSMC/OSAT to select packaging options ensuring system‑level compliance.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×