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High Speed Digital Design Engineer

Job in Palo Alto, Santa Clara County, California, 94301, USA
Listing for: Actalent
Full Time position
Listed on 2026-08-13
Job specializations:
  • Engineering
    Electronics Engineer, Hardware Engineer, Systems Engineer, Test Engineer
Job Description & How to Apply Below

High Speed Digital Design Engineer

The High Speed Digital Design Engineer plays a key role in designing the core compute, communication, and monitoring platforms that power advanced vehicle charging and residential/industrial energy storage products. This role focuses on architecting and developing next-generation high-speed digital systems, including high-bandwidth data acquisition platforms, real-time control processors with multi-gigabit interfaces, and signal integrity-critical printed circuit boards. You will take designs from concept through production, ensuring robust performance, reliability, and manufacturability in demanding energy electronics applications.

Responsibilities
  • Architect and design high-speed digital systems and PCB assemblies for energy products, including platforms with DDR memory interfaces, Gigabit Ethernet, USB 3.x, PCIe, LVDS, and other multi-gigabit communication links.
  • Own end-to-end hardware design from schematic capture and component selection through layout review, design optimization, bring-up, validation, and production release.
  • Perform detailed signal integrity and power integrity analysis, including pre- and post-layout simulations, to establish and verify robust high-speed design margins.
  • Configure and use SI/PI simulation tools to evaluate transmission line behavior, impedance matching, termination strategies, jitter, crosstalk, and return loss for high-speed interfaces.
  • Guide and review PCB layout activities, including stack-up design, controlled impedance definition, floor planning, layer assignment, via stitching, and plane partitioning for multi-Gbps signaling.
  • Collaborate closely with mechanical, firmware, EMC, general low-voltage electrical, RF, design validation, thermal, compliance, reliability, and manufacturing test engineers to deliver integrated system solutions.
  • Select and interface system-on-chips (SoCs), FPGAs, DDR memory devices, Ethernet PHYs, and high-speed transceivers appropriate for performance, cost, and reliability targets.
  • Plan and execute bench validation and debug of high-speed digital circuits, including measuring eye diagram compliance against relevant communication protocols.
  • Use high-speed lab equipment such as high-bandwidth oscilloscopes, TDR/TDT instruments, VNAs, BERTs, and protocol analyzers to characterize and troubleshoot designs.
  • Develop and refine basic firmware configurations and boot loader settings related to high-speed interfaces, such as on-die terminations and device configuration registers.
  • Create and use basic scripts to read, modify, and automate test procedures and data analysis for digital hardware validation.
  • Document design decisions, analysis results, test plans, and validation outcomes to support design reviews and product certification.
  • Support manufacturing test and production teams by providing guidance on test strategies, design-for-test considerations, and failure analysis for high-speed digital hardware.
Essential Skills
  • Bachelor's degree in Electrical Engineering or equivalent experience with high-speed digital design.
  • Hands-on experience designing high-speed digital circuits that incorporate DDR memory, PCIe, USB 3.x, Gigabit Ethernet, LVDS, or similar multi-gigabit interfaces.
  • Strong understanding of signal integrity fundamentals, including transmission line theory, impedance matching, termination strategies, jitter, crosstalk, and return loss.
  • Experience performing detailed signal integrity and power integrity simulations using tools such as Hyper Lynx, Ansys SIwave, Cadence Sigrity, ADS, HFSS, or equivalent.
  • Proficiency in selecting and interfacing SoCs, FPGAs, DDR memory, Ethernet PHYs, and high-speed transceivers for complex digital systems.
  • Experience in PCB stack-up design, controlled impedance routing, layer assignment, via stitching, and plane partitioning for multi-Gbps signaling.
  • Demonstrated ability to perform or guide PCB layout, including stack-up definition, controlled impedance specification, and board-level floor planning.
  • Hands-on debug experience with high-speed lab equipment, including high-bandwidth oscilloscopes (greater than 4 GHz), TDR/TDT instruments, VNAs, BERTs, and protocol analyzers.
  • Ability to perform bench validation and debug of high-speed interfaces, including measuring and interpreting eye diagrams for compliance with communication standards.
  • Basic firmware skills sufficient to understand and adjust boot loader configurations and device settings, such as on-die terminations and interface configuration registers.
  • Basic scripting ability to read, modify, and automate test procedures and data analysis for digital hardware validation.
  • Strong collaboration skills and proven experience working effectively with cross-functional teams including LV electrical, RF, firmware, FPGA, layout, test, and manufacturing engineers.
Additional

Skills & Qualifications
  • Experience with DDR memory and Ethernet interface design, including timing closure and layout optimization.
  • Familiarity with additional digital interfaces such…
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