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Member of Technical Staff — On-Chip Interconnect & High-Speed Fabric Design

Job in Palo Alto, Santa Clara County, California, 94306, USA
Listing for: Kindredventures
Full Time position
Listed on 2026-08-16
Job specializations:
  • Engineering
    Hardware Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 260000 - 420000 USD Yearly USD 260000.00 420000.00 YEAR
Job Description & How to Apply Below

About Architect

Architect is a frontier AI lab for chip design. We build AI models and tools for on-demand custom ASICs  goal is to co-design custom ASICs alongside evolving ML workloads, and enable a new era of domain-specific chips that unlock capabilities impossible with current hardware paradigms. Born out of Stanford Research, our team blends AI with Silicon with a founding team from Anthropic, Google Deep Mind, Meta Super Intelligence, xAI, Apple and Intel.

What You’ll Do

As a Founding Member of the Technical Staff on the RTL Design team at Architect, you’ll own the AI-driven microarchitecture and RTL design of the on-chip interconnect fabric and high-speed I/O data movement subsystems going into production silicon. You will define, drive, and revise the block-level micro-architecture specification for NoC routers, crossbar switches, high-speed fabric bridges, and peer-to-peer data transfer engines — ensuring low-latency, high-bandwidth, and deadlock-free communication across all SoC agents.

Core Responsibilities
  • Own the on-chip fabric RTL end-to-end
    : from NoC topology and router microarchitecture through code generation, lint, CDC, synthesis, and timing closure using our AI-driven design flow.

  • Design and implement AMBA-based interconnect fabrics
    : including AXI/ACE/CHI-compliant crossbar switches, network interfaces (NIs), protocol converters (AXI-to-CHI bridges, AXI-to-AHB/APB down converters), and multi-layer interconnect configurations optimized for ML accelerator traffic patterns.

  • Architect NoC routers and topologies
    : including virtual-channel routers, wormhole/flit-based switching, adaptive routing algorithms, QoS-aware arbitration (bandwidth regulation, latency-critical path prioritization), and deadlock-free network design for mesh/ring/tree topologies.

  • Design high-speed I/O fabric bridges and peer-to-peer engines
    : including PCIe/CXL-to-fabric bridges, chip-to-chip interconnect logic (UCIe, custom die-to-die links), peer-to-peer DMA controllers for direct device-to-device transfers bypassing host memory, and coherent/non-coherent multi-chip fabric extensions.

  • Work directly with the principal architect to refine microarchitectural specs, resolve implementation trade-offs (latency vs. bandwidth vs. area, coherence overhead vs. performance), and feed area/timing/power realities back into the architecture and internal AI systems.

  • Define and maintain interface specifications
    : AMBA AXI4/AXI5, ACE/ACE-Lite, CHI (with snoop filter interfaces), AXI-Stream for streaming datapaths, custom sideband channels for QoS/ordering, and high-speed Ser Des-facing interfaces for off-chip links.

  • Build and maintain RTL infrastructure for our in-house AI-driven flow: design automation scripts, NoC configuration generators, regression flows, lint/CDC waivers, and integration collateral for the interconnect subsystem.

  • Close collaboration with DV
    :
    Support verification bring-up with interconnect reference models, protocol compliance checkers (AXI/CHI protocol monitors), SVA assertions for ordering rules and deadlock freedom, coverage plans targeting corner-case traffic scenarios (multi-master contention, QoS starvation), and architectural documentation for verification closure.

  • Close collaboration with SW and ML
    :
    Support and guide our SW and ML experts to revise and improve our in-house AI flow based on your interconnect domain expertise — particularly around traffic modeling and fabric configuration optimization.

  • Support FPGA prototyping on Xilinx for early functional validation of the fabric, including multi-master traffic generation and performance characterization on FPGA platforms.

What We’d Like to See
Required Qualifications
  • Degree
    :
    Bachelor’s, Master’s, or PhD in Electrical Engineering, Computer Engineering, or a closely related field.

  • Experience
    : 5+ years (10+ preferred) in RTL design with at least one advanced-node tapeout experience involving on-chip interconnects, NoC fabrics, or high-speed I/O subsystems.

  • AMBA Protocol Expertise
    :
    Deep familiarity with ARM AMBA protocol suite — AXI4/AXI5 (channel mechanics, burst types, ordering, exclusive access), ACE/ACE-Lite (coherence transactions, snoop channels), CHI…

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