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Member of Technical Staff — Memory Subsystem Architecture & Design

Job in Palo Alto, Santa Clara County, California, 94306, USA
Listing for: Architect
Full Time position
Listed on 2026-08-16
Job specializations:
  • Engineering
    AI Engineer (Applied/Software), Systems Engineer, Hardware Engineer, Test Engineer
Salary/Wage Range or Industry Benchmark: 260000 - 360000 USD Yearly USD 260000.00 360000.00 YEAR
Job Description & How to Apply Below

About Architect

Architect is a frontier AI lab for chip design. We build AI models and tools for on-demand custom ASICs  goal is to co-design custom ASICs alongside evolving ML workloads, and enable a new era of domain-specific chips that unlock capabilities impossible with current hardware paradigms. Born out of Stanford Research, our team blends AI with Silicon with a founding team from Anthropic, Google Deep Mind, Meta Super Intelligence, xAI, Apple and Intel.

What You’ll Do

As a Founding Member of the Technical Staff on the RTL Design team at Architect, you’ll own the AI-driven microarchitecture and RTL design of the memory subsystem going into production silicon. You will define, drive, and revise the block-level micro-architecture specification for memory controllers, memory hierarchy management, and memory-side accelerators — ensuring maximum bandwidth utilization, minimal latency, and efficient power delivery for compute-intensive ML workloads.

Core Responsibilities
  • Own the memory subsystem RTL end-to-end
    : from DDR/HBM controller design through code generation, lint, CDC, synthesis, and timing closure using our AI-driven design flow.

  • Design and implement memory controllers
    : including DDR5/LPDDR5X PHY-side controller logic, HBM3/HBM3E pseudo-channel controllers, command scheduling (open-page/close-page policies, bank-level parallelism), refresh management, and ECC/RAS engines.

  • Architect the memory hierarchy
    : including multi-level cache controllers, scratchpad memory managers, coherency protocol engines (where applicable), prefetch engines, and bandwidth partitioning/QoS mechanisms to serve diverse traffic profiles from ML accelerator datapaths.

  • Design memory-side accelerators
    : near-memory compute logic, scatter-gather DMA engines, address translation/remapping units, compression/decompression engines co-located with memory interfaces, and intelligent prefetchers tuned for ML access patterns.

  • Work directly with the principal architect to refine microarchitectural specs, resolve implementation trade-offs (bandwidth vs. latency vs. area vs. power), and feed area/timing/power realities back into the architecture and internal AI systems.

  • Define and maintain interface specifications
    : DDR PHY interfaces (DFI), HBM PHY interfaces, on-chip SRAM interfaces, AXI/ACE/CHI for memory-facing fabric ports, and custom interfaces for near-memory accelerator datapaths.

  • Build and maintain RTL infrastructure for our in-house AI-driven flow: design automation scripts, regression flows, lint/CDC waivers, and integration collateral for the memory subsystem.

  • Close collaboration with DV
    :
    Support verification bring‑up with memory timing models, protocol‑compliant BFMs, SVA assertions for JEDEC protocol compliance, coverage plans targeting worst‑case scheduling scenarios, and architectural documentation for verification closure.

  • Close collaboration with SW and ML
    :
    Support and guide our SW and ML experts to revise and improve our in-house AI flow based on your memory subsystem domain expertise — particularly around workload‑driven memory access pattern optimization.

  • Support FPGA prototyping on Xilinx for early functional validation of memory controllers, including bring‑up with DDR MIG IPs and HBM validation platforms.

What We’d Like to See
Required Qualifications
  • Degree
    :
    Bachelor’s, Master’s, or PhD in Electrical Engineering, Computer Engineering, or a closely related field.

  • Experience
    : 5+ years (10+ preferred) in RTL design with at least one advanced-node tapeout experience involving memory subsystems (DDR/LPDDR/HBM controllers, cache hierarchies, or memory-intensive SoC subsystems).

  • Memory Interface Expertise
    :
    Deep familiarity with JEDEC memory standards — DDR5/LPDDR5X command/address protocols, timing parameters, training sequences, and/or HBM2E/HBM3 pseudo‑channel architecture, stack addressing, and interleaving schemes.

  • Memory Controller Design
    :
    Hands‑on experience designing or owning memory controller blocks including command schedulers, bank state machines, refresh engines (per-bank, fine‑granularity), read/write turnaround optimization, and PHY interface timing (DFI or proprietary).

  • Memory Hierarchy Architecture
    :
    Experienc…

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