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Manager, Mechanical Engineering - Electronics Packaging

Job in Parsippany-Troy Hills, Morris County, New Jersey, USA
Listing for: Marotta Controls, Inc.
Full Time position
Listed on 2026-03-07
Job specializations:
  • Engineering
  • Management
Salary/Wage Range or Industry Benchmark: 125000 - 150000 USD Yearly USD 125000.00 150000.00 YEAR
Job Description & How to Apply Below

Position: Manager, Mechanical Engineering - Electronics Packaging

Location: Parsippany, NJ

Job : -I-NB

# of Openings: 2

Elevate your career at Marotta Controls, a New Jersey Top Workplace three years running! Dedicated to innovation, quality and excellence, we deliver cutting edge control systems for the Aerospace & Defense industry. At Marotta, we value bold thinking and teamwork, and we empower our employees to push boundaries while delivering top-tier solutions to our customers. Our team fosters a fun, collaborative culture where creativity and technical excellence thrive!

Your next big opportunity starts here. Be part of a company where your work supports a mission that makes a difference—apply today!

Manager, Mechanical Engineering – Electronics Packaging Design (PAS)

Job Summary of the Position

The Engineering Manager leads day-to-day execution of mechanical design activities supporting ruggedized electronics packaging within the PAS business unit.

This role is responsible for team management, program-level execution, and adherence to established Marotta-internal structural, thermal, vibration, EMI/EMC, and IPC Class 3 design standards. Additionally, this role participates in the development and maintenance of mechanical engineering procedures, reference manuals, and design standards.

Reports to:

Director, Mechanical Engineering, PAS.

Scope of Responsibility
  • Direct management of 5–10 mechanical engineers.
  • Enforcement of established design standards and margin policies.
  • Support of design, integration, and qualification activities under Senior Manager/Director oversight.
  • Engineering & Technical Leadership
  • Assign and manage packaging-engineering design tasks and resources.
  • Ensure design compliance with customer/ contractual performance requirements.
  • Oversee execution of thermal, structural, and vibration/shock analysis.
  • Ensure IPC Class 3 mechanical integration practices.
  • Ensure EMI shielding and grounding implementation as appropriate.
  • Ensure application of environmental sealing techniques as appropriate.
  • Drive disciplined execution through gated reviews (SRR, PDR, CDR, TRR, FCA/PCA).
  • Participate and drive closure in failure investigation, root cause analysis, and corrective action (FRACAS) activities.
  • Support proposal efforts with credible technical, labor, and schedule inputs and risk assessments.
  • Maintain AS9100 compliance and audit readiness within the mechanical discipline.
  • Spearhead electronic packaging-related issue resolution.
  • Escalate systemic risks appropriately.
  • Enforce mechanical engineering procedures and documentation controls.
  • Ensure AS9100 compliance at team level.
  • Institutionalize lessons learned into formal design guidance.
  • Improve repeatability, documentation quality, and configuration control discipline.
  • Ensure analysis assumptions and modeling practices are standardized and traceable.
    • Additionally, Participate in development, maintenance, and enforcement of:
      • Mechanical engineering procedures and work instructions
      • Electronics packaging design standards
      • Engineering design reference manuals
      • Design review checklists and documentation controls
  • Team Development
    • Conduct performance reviews and development planning.
    • Mentor and develop mechanical engineers in technical rigor and execution discipline.
    • Provide clear performance expectations and structured feedback.
    • Foster cross-functional collaboration.
Required Qualifications
  • Bachelor’s degree in Mechanical, Aerospace, or related discipline.
  • 8+ years aerospace/defense experience.
  • 2–3 years leadership experience preferred.
  • Demonstrated experience designing electronics packaging for harsh environments (vibration, shock, thermal cycling).
    • Experience with structural, vibration, and shock design.
    • Experience with thermal management design (conduction, convection, radiation cooling methods).
    • Working knowledge of IPC Class 3 requirements for CCA/PCB design and manufacturability.
    • Familiarity with EMI shielding, grounding, and environmental sealing techniques.
    • Familiarity with connector selection for aerospace applications.
  • Working knowledge of thermal, structural, and vibration analysis principles; familiarity with FEA tools.
  • Proficiency with 3D CAD systems (PTC Creo preferred).
  • Workin…
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