Fabrication R&D Scientist, Center Quantum Computing

Fabrication R&D Scientist, Amazon Center for Quantum Computing

Location:

Pasadena, CA, USA

• Develop and optimize processes to fabricate high‑coherence superconducting qubits.
• Develop advanced 3D interconnect and routing technologies for integrating superconducting quantum technologies.
• Analyze inline metrology and electrical test data.
• Develop and maintain integration documentation, design rules, and standard operating procedures.
• Interact with project leads to provide feedback that continuously improves different processes.
• Stay updated with the latest advancements and industry trends in process integration and apply knowledge to improve processes and drive innovation.
• Provide technical guidance and support to junior colleagues, fostering a collaborative and knowledge‑sharing work environment.

The candidate will develop novel technologies using micro‑ and nano‑fabrication techniques inside the cleanroom (independently or in collaboration with other scientists, engineers, and technicians) for next‑generation quantum computing. Outside the cleanroom, the candidate will plan experiments, analyze data, and conceive future innovations.

• PhD in mechanical engineering, electrical engineering, material science, physics or equivalent.
• A demonstrated track record of original, impactful work done in nanofabrication, MEMS, or 2.5/3D integration.
• Effective at managing multiple tasks/projects and working independently or within a team environment with other scientists, engineers, and technicians who might have a wide range of technical skill levels.
• Great problem‑solving and analytical skills.
• Strong verbal, written, and data presentation skills.

• 2+ years work experience in process integration in a 200/300 mm foundry environment (preferably in R&D).
• Hands‑on experience with manufacturing execution systems; electron beam lithography; photolithography; wafer‑level wet/dry etching techniques; wafer cleaning and lift‑off techniques; thin film deposition and metrology techniques; electroplating; wafer thinning; chemical mechanical polishing; temporary and permanent wafer‑level bonding; wafer‑level and flip‑chip packaging techniques; 2.5/3D integration schemes.
• Familiarity with superconducting quantum computing components, fabrication, and packaging techniques.
• Experience in performing failure analysis, root‑cause investigation for process excursions, yield monitoring, and statistical process control.
• Proficient in at least one of the following:
  Python, Julia, MATLAB or other scripting languages.
• Proficient in statistical data analysis, process optimization, and design of experiments using JMP or Minitab.

Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a U.S. export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility.

Salary range: $ – $ USD annually.

Benefits include health insurance (medical, dental, vision, prescription, basic life & AD&D insurance, supplemental life plan options), employee assistance program, mental health support, medical advice line, flexible spending accounts, adoption and surrogacy reimbursement coverage, 401(k) matching, paid time off, and parental leave.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies.

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