Senior Thermal Engineer – Electronic Cooling

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Amphenol High Speed Products Group is the market leader for high-speed, high-bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. We are currently seeking a Senior Thermal Engineer - Electronic Cooling to join our team.

The position will be located in Etters, PA.

We are seeking a highly motivated Thermal Engineer to join our Active Thermal Solutions team. This role is responsible for developing and optimizing active thermal management solutions for high-speed interconnect systems.

The ideal candidate will collaborate closely with customers to define boundary conditions, perform thermal simulations, validate designs through lab testing, and deliver optimized, production-ready thermal solutions that meet performance, reliability, and manufacturability requirements.

Customer Collaboration

• Engage directly with customers to gather thermal boundary conditions, system-level constraints, and performance requirements.
• Translate customer needs into actionable simulation and test plans.

Thermal Simulation and Analysis

• Develop and execute thermal models using CFD tools (e.g., ANSYS Icepak, FloTHERM, or equivalent).
• Analyze airflow, temperature distribution, and heat dissipation for active thermal solutions in high-density electronic cooling environments.
• Perform sensitivity and optimization studies to ensure thermal performance meets design goals.

Experimental Validation

• Work with lab teams to plan and conduct thermal testing and validation.
• Correlate experimental data with simulation results to refine and validate models.
• Identify and troubleshoot thermal design issues through root‑cause analysis and iterative testing.

Optimization and Reporting

• Optimize designs based on simulation and test results to balance performance, cost, and manufacturability.
• Prepare detailed technical reports summarizing analysis, findings, and recommendations.
• Present results and optimized solutions to customers and cross‑functional teams.

** Education & Experience**

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field.
• 5+ years of industry experience in thermal design or analysis for cooling electronic systems or interconnect hardware preferred
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** Technical Skills**

• Proficiency with CFD tools (ANSYS Icepak, FloTHERM, or equivalent).
• Experience with thermal instrumentation and data acquisition (thermocouples, IR cameras, etc.).
• Familiarity with CAD software (Solid Works, Creo, NX, or similar).
• Strong understanding of heat transfer, fluid dynamics, and electronic packaging.

** Soft Skills**

• Excellent problem‑solving and analytical skills.
• Strong communication and presentation abilities for customer interaction and reporting.
• Ability to manage multiple projects in a fast‑paced environment.

• Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O modules, Near package & On‑package optics, cold plates, and other electronic liquid cooling solutions.
• Background in active cooling technologies (fans, blowers, heat pipes, vapor chambers, etc.).
• Understanding of electrical and mechanical design trade‑offs in system…