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Packaging Design Architect — Substrate & Silicon Integration

Job in Peoria, Maricopa County, Arizona, 85381, USA
Listing for: Jobtailor
Full Time position
Listed on 2026-07-14
Job specializations:
  • Engineering
    Hardware Engineer, Electronics Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 150000 - 210000 USD Yearly USD 150000.00 210000.00 YEAR
Job Description & How to Apply Below

Jobtailor seeks a senior engineer to lead substrate design from concept to tape out, defining layout, routing, and design rules. You will work with silicon and hardware teams to optimize performance and pinout, resolve DRCs, and document all steps in the PLM system.

Ideal candidates have 10+ years in package/PCB/IC design, strong semiconductor fabrication knowledge, and expertise with simulation tools such as Mentor, Cadence, SPICE, and Ansys. This is a hands-on, highly collaborative role.

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