Architecture Analyst
Job in
Peoria, Maricopa County, Arizona, 85381, USA
Listed on 2026-09-08
Listing for:
Jobtailor
Full Time
position Listed on 2026-09-08
Job specializations:
-
Engineering
Manufacturing Engineer, Packaging Engineer, Process Engineer, Quality Engineering
Job Description & How to Apply Below
- Translate product requirements into detailed package architecture specifications
- Lead technology trade-off decisions across electrical, mechanical, thermal, and reliability requirements
- Collaborate with silicon, hardware, and package leads to deliver package outputs and address roadblocks
- Oversee packaging development, including designs, processes, and procedures
- Drive continuous improvement in packaging quality standards
- Troubleshoot package designs and resolve technical issues
- Deliver innovative, cost-effective packaging solutions
- Partner with manufacturing teams on design-to-production transitions and tape-out readiness
- Apply Design for Manufacturing principles to optimize manufacturability and production efficiency
- Maintain and refine technical documentation for package development processes
- Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field with 9+ years of hands-on experience, OR a Master's degree in a relevant field with 6+ years of hands-on experience, OR a PhD in a relevant field with 4+ years of hands-on experience
- 4+ years of experience defining semiconductor/electronic package architectures and developing technical documentation
- Experience applying Design for Manufacturing (DFM) principles
- Experience utilizing Design of Experiments (DOE) methodologies
- Experience troubleshooting package design and manufacturing issues
- Advanced understanding of semiconductor packaging technologies and industry trends
- Experience leading cross-disciplinary teams in a technical environment
- Excellent analytical, communication, and problem-solving skills
- Ability to collaborate cross-functionally with silicon, hardware, and manufacturing teams
Demonstrates expertise in semiconductor packaging technologies and Design for Manufacturing principles, with a strong focus on delivering innovative packaging solutions and optimizing production efficiency. Proven ability to lead cross-disciplinary teams and troubleshoot complex design and manufacturing issues.
Highest-signal resume keywords- Semiconductor Packaging Architecture
- Design for Manufacturing (DFM)
- Design of Experiments (DOE)
- Technical Documentation Development
- Cross-Disciplinary Team Leadership
- Mechanical Engineering
- Electrical Engineering
- Materials Science
- Packaging Development
- Troubleshooting Package Design
- Continuous Improvement
- Cost-Effective Packaging Solutions
- Manufacturing Transition
- Technical Documentation
- Analytical Problem-Solving
- Excellent Communication
- Collaboration
- Analytical Skills
- Semiconductor Packaging Technologies
- Manufacturing Efficiency
- Technical Environment
- Industry Trends
- Cross-Functional Collaboration
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