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End-to-End Packaging Design Architect – Substrate/SiP
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-06-07
Listing for:
Intel Corporation
Full Time
position Listed on 2026-06-07
Job specializations:
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Design & Architecture
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Engineering
Hardware Engineer
Job Description & How to Apply Below
Intel Corporation is seeking a Packaging Design Architect in Phoenix, Arizona. This role involves the end-to-end development of substrate design, collaborating with silicon and hardware teams, and optimizing package design.
The ideal candidate will have a Ph.D. or Master's degree along with over 10 years of experience in package or PCB design. A strong background in semiconductor fabrication and design tools such as Cadence and Mentor is crucial.
This full-time position offers competitive compensation and requires an on-site presence.
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