×
Register Here to Apply for Jobs or Post Jobs. X

Packaging Module Process Innovator

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-02-23
Job specializations:
  • Engineering
    Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 115110 - 219550 USD Yearly USD 115110.00 219550.00 YEAR
Job Description & How to Apply Below
A leading semiconductor technology company in Phoenix is looking for a Packaging Module Process Development Engineer.

Your role will involve developing and optimizing advanced semiconductor packaging solutions and improving manufacturing efficiency. A bachelor's degree in a STEM field with 5+ years of industry experience is required, alongside experience with statistical controls and FMEA. The position offers competitive salaries and excellent benefits, requiring on-site presence.
#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)

Job Posting Language
Employment Category
Education (minimum level)
Filters
Education Level
Experience Level (years)
Posted in last:
Salary