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Hybrid- Packaging Module Engineer
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-02-28
Listing for:
Intel Corporation
Full Time
position Listed on 2026-02-28
Job specializations:
-
Engineering
Systems Engineer
Job Description & How to Apply Below
A leading semiconductor company in Phoenix, Arizona, is seeking a Packaging Module Development Engineer to contribute to packaging technology advancements and optimize assembly processes. The ideal candidate will hold a PhD in a relevant engineering field and showcase strong leadership and analytical skills. This full-time position offers a hybrid work model and competitive compensation with excellent benefits.
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