Packaging Module Process Development Engineer

Job Details Job Description

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division focused on next-generation semiconductor packaging solutions.

• Advanced semiconductor packaging technologies beyond traditional methods
• 3D packaging solutions and chiplet integration
• High-performance computing packaging for data centers and AI
• Heterogeneous integration of different chip technologies
• Scaling packaging density while improving thermal and electrical performance

• Enable Moore's Law continuation through advanced packaging
• Reduce system-level power consumption and improve performance
• Support Intel's IDM 2.0 strategy and foundry services
• Develop packaging solutions for emerging workloads (AI, edge computing)

• Develop assembly processes and apply novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimize and improve the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develop process and equipment specifications applying principles for design of experiments and data analysis, and document improvements through white papers.
• Ensure manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures and flows.
• Establish material specifications for contract assemblers and raw material vendors and interface with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develop new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Set reliability requirements to meet customer needs and influence design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Lead efforts toward innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provide consultation concerning packaging problems and improvements in the packaging process and respond to customer/client requests or events as they occur.
• Deliver standardization in product qualification, manufacturing quality systems, and methods and continuously engage with packaging technology development and partner engineering groups on process/technology maturity for products toward key risk areas in meeting product milestones.

• The candidate must have bachelor’s degree in engineering, physics, chemistry or related STEM field with 5+ years of industry experience.
• 6+ months of experience with statistical controls
• 6+ months experience FMEA and/or DOE
• 6+ months of semiconductor fabrication related experience

• Master’s degree in engineering, physics, chemistry or related STEM field with 4+ years of industry experience.
• Ph.D. degree in engineering, physics, chemistry or related field with 2+ years of industry experience
• Preference for experience with dispense and/or material development.
• Product ownership, change control management and data systems
• Project management and delivering results for time critical technical projects.
• Technical innovation and deliver results for complex, time critical technical projects.
• Excellent verbal and written communication skills.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Experienced Hire

Shift 1 (United States of America)

US, Arizona, Phoenix

N/A

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale…