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Senior Packaging Engineer, Customer Solutions; Semiconductor

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-05-27
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering, Packaging Engineer
Salary/Wage Range or Industry Benchmark: 190610 - 269100 USD Yearly USD 190610.00 269100.00 YEAR
Job Description & How to Apply Below
Position: Senior Packaging Engineer, Customer Solutions (Semiconductor)

Intel Corporation in Phoenix, Arizona, is seeking an experienced professional for semiconductor packaging. The role involves collaborating with product design teams and serving directly as the engineering interface to IFS customers, focusing on technological reviews and packaging services.

Candidates must possess a Bachelor's degree in a relevant STEM field and have over 9 years of relevant experience. The position offers a competitive salary range from $190,610 to $269,100 and requires an on-site presence.

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Position Requirements
10+ Years work experience
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