Packaging Module Development Engineer

Job Details

Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module teams, package architecture, integration, and assembly, substrate, optical component materials supply chain, as well as semiconductor vendors and assembly/test providers worldwide. The position requires a strong understanding of optical materials and assembly process, optical component design, manufacturing, and test, active optical alignment processes.

This role spans across pathfinding through high volume manufacturing for successful integrated co-packaged optics packages.

• Conducting fundamental studies and performing experiments to characterize materials, identify potential failure modes, understand the structure-property-performance interactions, assess feasibility of material use on product, and make material technology recommendations.
• Working in close collaboration with materials suppliers to develop and source materials formulations that meet technology, quality, availability, and cost targets.
• Developing a fundamental understanding of Intel's assembly process and materials interactions and impact on product performance.
• Collaborating closely with Materials, equipment and process engineering teams to build material technologies on test vehicles and products and assessing their performance.
• Develops materials assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Develops new techniques and metrologies, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.

• Technical problem-solving, strong presentation and communication skills, fast-learning skills and solid expertise in their technical field, willingness to collaborate effectively as a team player across multiple teams.

• Candidates must possess a MS with 3+ years of experience or PhD degree and with 1+ years of work experience post‑graduation. Graduate degree discipline can be in Optics or Photonics Engineering, Materials Science Engineering related to Photonics, Applied Physics, Chemical Engineering, or related fields.

1+ years of experience in one or more of the following:

• Semiconductor packaging and optical assembly experience
• Optical connector/component design and manufacturing experience
• Experience in photolithography materials and process
• Ceramics, glass processing

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary

Location:

US, Arizona, Phoenix

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $ -  USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

This role will require an on‑site presence.