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Packaging Module Engineer: Design & Qualification Lead; Onsite
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-05-31
Listing for:
Intel
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Intel in Phoenix, Arizona is seeking a Packaging Module Engineer to develop innovative packaging solutions that enhance performance and sustainability. You'll lead packaging development across various teams, ensuring compliance with regulations while improving efficiency in the semiconductor industry.
The position requires a Master's degree in a STEM field and offers a total compensation package with competitive pay and comprehensive benefits. Join Intel in pioneering technology solutions globally.
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