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Co-Packaged Optics Packaging Engineer
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-05-31
Listing for:
Intel
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Manufacturing Engineer, Materials Engineer
Job Description & How to Apply Below
Intel is seeking an experienced Packaging Module Development Engineer in Phoenix, AZ, to develop packaging materials technology for optical semiconductor assemblies. Responsibilities include conducting studies, collaborating with materials suppliers, and developing assembly processes that align with future technology roadmaps.
Candidates should have a strong understanding of optical materials, assembly processes, and a relevant graduate degree. The position offers a competitive salary range of $115,110 - $219,550.
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