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Packaging Engineer - Semiconductor Assembly & Sustainability

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel
Full Time position
Listed on 2026-05-31
Job specializations:
  • Engineering
    Packaging Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Intel is seeking a Product Packaging Engineer in Phoenix, AZ. You'll design and develop innovative packaging solutions that streamline product delivery while minimizing environmental impact. This role involves collaboration with diverse teams to meet operational goals, ensuring high-quality standards.

Qualifications include a Bachelor’s degree in Engineering and relevant experience in semiconductor packaging. Join Intel to help shape the future of technology and leave a global impact.

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