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Senior Engineering PM: Chiplet Packaging & Customer Programs
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-05-31
Listing for:
Amkor Technology, Inc.
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Packaging Engineer
Job Description & How to Apply Below
Amkor Technology, Inc. is seeking a Business Unit Product Management professional in Tempe, AZ, focusing on Advanced Chiplets/FCBGA Packaging. This role involves managing customer accounts, driving internal processes, and supporting product qualification and production ramp-ups.
The ideal candidate will have 10+ years of semiconductor packaging experience and a Bachelor’s degree in Engineering. A hybrid work schedule is available, and candidates should reside near the Amkor office or be willing to relocate.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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