Failure Analysis Technician

Overview

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A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade.

America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

As a Failure Analysis Technician, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

TSMC Arizona’s Quality & Reliability is responsible for incoming materials and final product quality, process and product qualification, and failure analysis.

Provide crucial support to our Quality & Reliability team by performing precise failure analysis on leading-edge semiconductor devices. This role involves operating advanced analytical tools, preparing samples, handling chemicals safely, and meticulously documenting findings to ensure product quality and aid in process improvement. The Failure Analysis Technician plays a key role in diagnosing issues and contributing to the continuous advancement of semiconductor technology.

• Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and SEM imaging.
• Operate TEM for imaging, analysis, and reporting.
• Perform TEM sample preparation, including site marking, de-layering, applying protective coatings (spin coating and/or CVD tools), and other necessary pre-treatments.
• Handle chemicals safely and in accordance with established PPE protocols.
• Collect, organize, and report data to internal and external customers.
• Assist engineers with the development of analytical methods.
• Maintain laboratory housekeeping (6S) environment and protocols.
• Support Fab manufacturing operations and participate in the team’s on-call schedule.

• Education: Associate's degree (A.A.S.) from a Science/Engineering/Technology program, or related field.
• Technical
  
  Skills:
  
  Basic PC skills (MS Windows OS and MS Office).
• Interpersonal
  
  Skills:
  
  Ability to work independently and prioritize tasks to meet deadlines.
• Must be a team player with a positive attitude and strong work ethic.
• Ability to handle pressure in a fast-paced working environment.
• Physical Requirements: May be required to work in a cleanroom environment (Near-line FIB/TEM).

• Technical
  
  Skills:
  
  Experience in TEM sample preparation for semiconductor devices in advanced process nodes (