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Mechanical Packaging Design Engineer – Semiconductor

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-06-05
Job specializations:
  • Engineering
    Mechanical Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 105650 - 149150 USD Yearly USD 105650.00 149150.00 YEAR
Job Description & How to Apply Below

Intel Corporation in Phoenix, AZ, is seeking a Mechanical Design Engineer for semiconductor packaging. This role focuses on designing and developing mechanical components and tooling, collaborating with cross-functional teams, and ensuring design manufacturability.

Candidates should have a Bachelor's degree in mechanical engineering, familiarity with CAD tools like Solid Works, and strong communication skills. This full-time position offers a competitive salary and benefits.

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