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Senior Member of Technical Staff; CMP Engineer

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-06-05
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Position: Senior Member of Technical Staff (CMP) Engineer
#
** Welcome!**## .
** Shape the Future of Semiconductor Innovation at Intel Foundry
**** Organization Overview
** Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.
** Position Summary
** MDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.
** Core Responsibilities
**** Technical Leadership
*** Process Development & Optimization:
Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
* Cross-Node Alignment:
Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
* Problem Resolution:
Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
** Strategic Execution
*** Customer-Centric Delivery:
Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions
* Technology Transfer:
Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
* Continuous Improvement:
Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
- Leadership Capability:
Ability to influence and drive results across multiple organizations and disciplines
- Business Acumen:
Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements
** Personal Attributes** - Communication

Skills:

Exceptional ability to communicate complex technical concepts to diverse audiences
- Initiative:
Self-motivated with strong persistence and ability to work independently

The Minimum qualifications are required to be initially considered for this position.  Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
** Minimum Qualifications**- 7+ years of experience in semiconductor manufacturing / process development or technology development- 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization

Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)- Previous semiconductor foundry experience
** Preferred Qualifications
** Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures with track record of successful technology development and HVM implementation
- Cross-functional leadership experience, including task force leadership for yield improvement initiatives

Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of

Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)
This role requires in-person collaboration to enable rapid decision-making and effective problem resolution. You'll work in a dynamic, fast-paced environment with competing priorities while maintaining the highest standards for safety, quality, and customer satisfaction. the success of next-generation semiconductor technologies.

This role offers exceptional opportunities for professional growth, technical leadership, and
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Position Requirements
10+ Years work experience
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