Intel Process Integration Engineer BE

Position: Intel Process Integration Engineer - (BE)
Job Details:

Job Description:

Join Intel and build a better tomorrow.

What we do:

The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap.

What we offer:

• We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth.
• As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.
• We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).
• We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.
• We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. Benefits:
We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work. Find more information about our amazing benefits here. The ideal candidate should exhibit behavioral traits that indicate:

Job Responsibilities include but are not limited to: 1. Process Flow Development
• Develop and define integrated process flows for interconnect modules.
• Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
• Optimize RC (resistance-capacitance) performance.
• Establish process windows and integration schemes.
2. Yield and Defect Reduction
• Identify BE-driven yield loss mechanisms such as open and short defects, metal voids, low k ILD damage, etc.
• Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
• Drive corrective actions to improve yield and cycle time.
3. Process Control and Monitoring
• Implement control plans and process monitoring strategies.
• Use statistical tools such as:
Cpk / Ppk, Control charts, Capability analysis
4. Reliability
• Ensure margins for electromigration, stress migration, TDDB, time dependent via degradation.
• Evaluate impact of process window shifts on reliability.
5. Technology Transfer
• Support ramp from RnD to high-volume manufacturing (HVM).
• Document process specifications and standard operating procedures (SOPs). 6. Cross-Functional Collaboration/Work with
• Device Engineering
• Equipment Engineering/Module Engineering
• Yield Engineering
• Reliability Teams
• Design Teams

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

* Candidate must possess a PhD degree in one of these fields:
Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.

* Candidate must possess at least one of the following:

6+ months experience on one or more of the following areas:

o Semiconductor device fabrication or nanotechnology.

o Electrical characterization of transistors or other semiconductor devices.

o Clean room process development.

Preferred Qualifications:

* JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).

* Strong understanding of Device physics (CMOS, FinFET, GAA, etc)

* Hand on experience in VLSI device fabrication and testing in the lab.

* Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.)

* Understanding statistical process control and charting methodology data…