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Lead Packaging Module Engineer: Equipment & Process
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-06-18
Listing for:
Dormont Manufacturing Co
Full Time
position Listed on 2026-06-18
Job specializations:
-
Engineering
Manufacturing Engineer
Job Description & How to Apply Below
Intel is seeking a Packaging Module Development Engineer to advance technology in semiconductor packaging. The role involves developing interconnect and thermal solutions, managing projects, and providing support for equipment performance in a high-volume manufacturing environment.
The ideal candidate will have a PhD or Master's degree in a related field and at least 1 year of experience in mechanical design or manufacturing systems. An annual salary range of $ to $ USD is offered with competitive benefits.
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