Semiconductor Packaging: Mechanical Design Engineer

Intel is looking for a proactive Mechanical Design Engineer in Phoenix, Arizona. In this role, you will be pivotal in the design and development of mechanical components for semiconductor packaging. Key responsibilities include designing packaging systems and maintaining mechanical designs. The ideal candidate holds a Bachelor's degree in mechanical engineering and has a solid foundation in CAD tools.

With a competitive annual salary range between $105,650 and $149,150, this position requires on-site presence and seeks strong communicators capable of cross-functional collaboration.