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Mechanical Design Engineer – Semiconductor Packaging

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel
Full Time position
Listed on 2026-06-18
Job specializations:
  • Engineering
    Mechanical Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 125000 - 150000 USD Yearly USD 125000.00 150000.00 YEAR
Job Description & How to Apply Below

Job Summary

We are seeking a proactive and detail‑oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross‑functionally and solving complex design problems with minimal supervision.

Key Responsibilities
  • Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
  • Develop and maintain mechanical designs and detailed drawings for:
    • Substrates
    • Integrated Heat Spreaders (IHS)
    • Stiffeners
    • Overall package assemblies
  • Design process media trays used during various stages of the assembly process.
  • Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
  • Act as the single point of contact for all packaging mechanical design collateral needs.
  • Proactively identify and solve design and process issues, ensuring timely project execution.
Minimum Skills And Qualifications
  • US Citizenship required.
  • Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
  • Bachelor's degree in mechanical engineering or in a STEM related field of study.
  • 1+ years' experience with CAD tools such as Solid Works, Siemens NX, and AutoCAD or similar 2D and 3D CAD software.
Preferred Skills
  • Master's degree in mechanical engineering or in a STEM related field of study.
  • Solid mechanical design foundation and 3D spatial awareness.
  • Excellent communication and interpersonal skills for effective cross‑functional collaboration.
  • Ability to interpret and generate technical drawings and specifications.
Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the U.S.: $ - $ USD.

This role will require an on‑site presence.

ADDITIONAL INFORMATION:
Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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