Packaging Module Development Engineer
Listed on 2026-06-19
-
Engineering
Electrical Engineering, Manufacturing Engineer, Process Engineer, Mechanical Engineer
The Role and Impact
As a Packaging Module Development Engineer within Intel's Assembly Technology Development (ATD) team, you will be at the forefront of innovation, driving the advancement of cutting-edge semiconductor packaging technologies that power the future of computing. Your work will enable Intel's leadership across mobile, edge, and hyperscale computing platforms by developing and optimizing industry-leading package assembly solutions. This dynamic role offers the unique opportunity to collaborate with cross-disciplinary teams, innovate across materials, equipment, and processes, and scale advanced packaging platforms for high-volume manufacturing.
Your contributions will directly impact quality, reliability, and manufacturability, ensuring Intel's roadmap stays ahead of the curve in delivering transformative technologies.
Key Responsibilities
- Develop First Level, Second Level, and Mid-Level Interconnect (FLI, SLI, MLI), as well as thermal and surface mount technology (SMT)/printed circuit board (PCB) metrology solutions, to support Intel's advanced packaging platforms.
- Collaborate with multifunctional teams to optimize assembly processes, focusing on quality, reliability, cost, yield, productivity, and manufacturability.
- Innovate next-generation materials, equipment, and fabrication techniques to advance semiconductor packaging capabilities.
- Conduct process development and equipment characterization through statistical techniques such as Statistical Process Control (SPC) and Design of Experiments (DOE).
- Manage dynamic technical projects to meet critical product development timelines.
- Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.
- Partner with suppliers and cross-organizational teams to ensure material specifications and quality requirements are met.
- Lead efforts in identifying and addressing potential package quality and reliability challenges through innovative techniques and tools.
The ideal candidate demonstrates:
- Proven track record of technical leadership, strategic planning, and critical thinking in challenging environments.
- Ability to manage shifting priorities while driving impactful results.
- Strong communication, influencing, and analytical skills to collaborate across diverse teams.
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.
Minimum Qualifications
Bachelor's or BS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 4+ years of relevant experience
-OR- Master's or MS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 3+ years of relevant experience
- OR- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 1+ years of relevant experience
Relevant Experience should include the following:
- Demonstrated expertise in metrology solutions for semiconductor and assembly technologies
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE).
Preferred Qualifications
- Demonstrated expertise in packaging fundamentals, quality and reliability standards, and redistribution layers (RDL) packaging.
- Experience in technology development, including delivering results for complex and time-critical technical projects.
- Familiarity with semiconductor fabrication processes, assembly technologies, and materials.
- Previous related work experience in a semiconductor foundry preferred
Join Intel and be a part of a team that redefines the future of semiconductor packaging. Your expertise will shape innovations that enable Intel to create world-changing technology that enriches the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits
Annual Salary Range for jobs which could be performed in the US $-$
* Salary range dependent on a number of…
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).