Failure Analysis Technician F21

Failure Analysis Technician F21

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world's most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here. TSMC Arizona is looking for a Failure Analysis Technician to join our 5-nanometer fab, located in sunny Phoenix, Arizona.

As a Failure Analysis Technician, you will demonstrate a strong sense of chip failure analysis and possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust. TSMC Arizona's Product Failure Analysis is responsible for chip failure analysis to reinforce our process robustness and ensure high yield and quality of the wafers.

Your main responsibilities include:

• Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting
• TEM sample preparation will also include sample pre-treatment such as site marking, de-layering, and other necessary steps.
• Chemicals handling in a safe manner with PPE is required.
• Collecting and organizing data, and reporting to engineers
• Assisting engineers with analytical method development.
• Maintaining laboratory housekeeping (6S) environment and protocols.
• Supporting Fab manufacturing operations and being part of our teams' on-call schedule.

Minimum qualifications:

• Applicants must be legally eligible to work in the United States and have:
• Associate degree (A.A.S.) or Bachelors degree at a Science/Engineering/Technology school or the equivalent education is preferred but not required.
• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (