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Senior Director, Thermal-Film Engineering HPC Packaging

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Dormont Manufacturing Co
Full Time position
Listed on 2026-07-03
Job specializations:
  • Engineering
    Systems Engineer, Process Engineer, Electrical Engineering, Research Scientist
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below
Position: Senior Director, Thermal-Film Engineering for HPC Packaging

Dormont Manufacturing Co is seeking a Senior Process Engineering Leader to drive development of high-thermal-conductivity thin films for advanced semiconductor applications. The role requires collaboration with technical teams to align on development roadmaps and customer strategies.

The ideal candidate will possess a Ph.D. and over 10 years of experience in the semiconductor industry, demonstrating leadership in process development and technology delivery. Competency with ALD/PEALD and CVD/PECVD processes is essential, as is a strong communication skill set for global collaboration.

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Position Requirements
10+ Years work experience
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