Packaging Module Development Engineer

Overview

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you ll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.

We re looking to hire a highly motivated mechanical engineer to join the Advanced Packaging Mechanical Analysis team located in Chandler, AZ. This role focuses on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing.

This role requires regular onsite presence to fulfill essential job responsibilities.

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
• Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
• Leverage both experimental and numerical methods across thermal, mechanical, and fluids domains to solve engineering problems.
• Utilize a combination of simulations and experiments as needed.
• Apply advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

• Demonstrated ability to work seamlessly between experiments and simulations.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

• PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.
• 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
• 3+ years of experience with Finite Element Analysis tools
• 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

• Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
• Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
• Experience with designing, planning and executing experiments, along with interpretation of results.
• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
• Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
• Programming/script development with artificial intelligence and machine learning concepts.
• Previous related work experience in a semiconductor foundry preferred.

• Job Type: College Grad
• Shift: Shift 1 (United States of America)
• Primary
  
  Location:
  
  US, Arizona, Phoenix

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers. From delivering cutting-edge silicon process and packaging technology leadership for the AI era to enabling customers to design leadership products, we focus on service, technology enablement and capacity commitments across global manufacturing and packaging networks.

We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation. The annual salary range for jobs which could be performed in the US is $ -  USD. The range reflects minimum and maximum target compensation across all US locations; individual pay is determined by location, skills, experience, and education.

This role will require on-site presence. Job posting details (work model, location or time type) are subject to change.

All qualified applicants will receive consideration for employment without…