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Packaging Multiphysics Simulation Engineer

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel
Full Time position
Listed on 2026-07-06
Job specializations:
  • Engineering
    Mechanical Engineer, Packaging Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 255200 USD Yearly USD 133800.00 255200.00 YEAR
Job Description & How to Apply Below

Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.

The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry’s best.

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