Director, Process Engineer – Dry Etch

Responsibilities

• leads dry etch process engineering efforts to drive technology development, process capability, and manufacturability across advanced CMOS technologies.
• responsible for development, optimization, and sustaining of dry etch processes across modules that may include plasma etch, reactive ion etch (RIE), atomic layer etch (ALE), conductor etch, dielectric etch, thermal etch, and related post-etch treatment or clean processes.
• drive safety, quality, performance, throughput, process capability, profile control, critical dimension uniformity, selectivity, lower defectivity, improved yield, and lower cost.
• partner successfully with internal organizations, factory teams, and external suppliers to meet Intel foundry customer needs on schedule.
• define and execute process experiments, analyze data, resolve tool and process issues, and deliver robust etch solutions that meet Intel foundry technology roadmap requirements.

• 10+ years of relevant work experience in the semiconductor industry with a strong focus on dry etch process development, process integration, or high-volume manufacturing support.
• Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
• 10+ Hands-on experience with dry etch process development, plasma etch equipment, recipe optimization, process characterization, and troubleshooting.
• 10+ Strong history of collaboration across process modules, integration teams, equipment engineering, manufacturing, yield, defect metrology, and external suppliers.
• Ability to work in a dynamic fab environment, support urgent manufacturing issues, and drive technical closure under schedule pressure.