Thermal Quality and Reliability Engineer

Role and Impact

As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will drive quality and reliability standards for cutting-edge packaging components, ensuring they meet the stringent requirements of our products and production environments. This dynamic role bridges technology development and manufacturing, empowering you to make impactful contributions to Intel's product development milestones and long-term customer satisfaction.

You will collaborate with diverse cross‑functional teams, influence key decision‑making processes, and innovate reliability models to shape the future of Intel's packaging technologies.

• Develop and maintain quality and reliability standards for packaging components, including defining inspection and testing mechanisms, conducting quality assessments, and performing statistical analyses.
• Evaluate materials, processes, and techniques used in production to ensure compliance with product and system‑level requirements.
• Define metrology strategies to capture comprehensive quality parameters across modules for packaging.
• Develop and sustain equipment to evaluate silicon and packaging technologies under simulated field conditions such as heat, humidity, and temperature variations.
• Analyze quality and wear‑out reliability data to identify potential risk areas and provide actionable insights for process improvement.
• Develop reliability models by performing statistical analysis to categorize failure impacts and assess risks in meeting customer specifications.
• Innovate new acceleration techniques, analytical tools, and quality screens to ensure early identification of potential issues with new packaging processes.
• Drive standardization in product qualification, manufacturing quality systems, and methods, enabling continuous improvement in quality and reliability practices.
• Collaborate with internal teams and external partners to ensure packaging process maturity, reduce risks, and meet product milestones.
• Respond to quality excursions, troubleshoot issues, and provide recommendations to improve product reliability and specifications.

• PhD degree in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field with at least 6 months of experience in semiconductor packaging, assembly processes, and understanding of failure modes and mechanisms.

• Proficiency in statistical process control, reliability modeling, and statistical data analysis.
• Knowledge of design of experiments (DOE) principles and data analytics tools.
• Experience with package technologies such as Ball Grid Array (BGA) or wafer‑level manufacturing.
• Familiarity with advanced analytical lab techniques like acoustic imaging, SEM, EDX, FTIR, or mechanical testing.
• Programming or scripting experience for data analysis using Python, SQL, or similar tools.
• Proven ability to lead and influence cross‑functional teams to achieve strategic goals.
• Strong problem‑solving skills and experience with methodologies such as 8D and 5 Whys.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Job Type: College Graduate

Shift: Shift 1 (United States of America)
Primary

Location:

US, Arizona, Phoenix

We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs such as health, retirement, and vacation. For more information, please visit Intel’s careers website.

Annual Salary Range for jobs which could be performed in the US: $ – $ USD.

This role requires an on‑site presence. Job posting details such as work model, location, or time type may be subject to change.