Advanced Substrate Packaging R&D Engineer
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-07-19
Listing for:
Intel Corporation
Full Time
position Listed on 2026-07-19
Job specializations:
-
Engineering
Packaging Engineer, Process Engineer, Quality Engineering, Manufacturing Engineer
Job Description & How to Apply Below
Intel Corporation is seeking a Substrate Packaging Research and Development Engineer to drive development of assembly processes and equipment for future packaging platforms. The role focuses on process development, reliability, and cost competitiveness across advanced package technologies.
The successful candidate will apply experimental design, statistical analysis, and engineering judgment to qualify new packaging solutions, working with supplier quality and procurement teams to ensure
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