Substrate Packaging R&D Engineer: Innovate & Optimize
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-07-20
Listing for:
Intel
Full Time
position Listed on 2026-07-20
Job specializations:
-
Engineering
Packaging Engineer, Process Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Intel is seeking a Substrate Packaging Research and Development Engineer to join the Packaging Technology Development organization in the US. You will develop novel assembly processes and equipment solutions to advance Intel’s packaging technology roadmap, driving process development, equipment optimization, and reliability for future package assemblies.
The role requires a PhD and strong data analysis, DOE, and materials science expertise, with collaboration across teams to ensure quality,
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