ATD MIHL Equipment Development Engineer

** Job Details:*
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* Job Description:

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* ** The Role and Impact*
* Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.

** Business group*
* Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.

** Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer*
* - Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.

- Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.

- Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.

- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.

- Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.

- Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.

- Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.

- Lead problem-solving initiatives and drive continuous improvement in equipment and processes.

- Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.

- Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.

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* Qualifications:

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* Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.  
** This position is not eligible for Intel immigration sponsorship.*
* ** Minimum Qualifications*
* + Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.

+  **-OR
- ** Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.

+  **-OR
- ** PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.

Relevant experience should include any of following:

- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

- Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing

- Competency in mechanical design software such as Solid Works or AutoCAD.

** Preferred Qualifications*
* - Proven ability to lead technical innovation and manage complex, time-sensitive projects.

- Understanding of semiconductor fabrication processes and packaging technologies.

- Familiarity with supply chain management in a manufacturing or materials qualification environment.

- Experience with high-precision manufacturing methods, including stamping and CNC machining.

Join Intel's team of innovators and contribute to defining the future of technology. Apply now to make your mark and…