Substrate Packaging Research and Development Engineer

Intel is seeking a Substrate Packaging Research and Development Engineer to join our Packaging Technology Development organization. The role focuses on developing innovative assembly processes and equipment solutions that enable Intel's future packaging technology roadmap. Responsibilities include driving process development, equipment optimization, package reliability, and manufacturing excellence for advanced package assembly technologies.

• Develop assembly processes and/or equipment and apply novel concepts to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimize and improve the efficiency of manufacturing packages to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Create process and equipment specifications using design of experiments and data analysis, and document improvements through white papers.
• Maintain equipment to evaluate silicon and package technologies under simulated field use conditions (heat, humidity, temperature cycle, dynamic forces).
• Ensure manufacturability of the physical layout of package design and oversee the cycle of manufactured package processes, procedures, and flows.
• Establish material specifications for contract assemblers and raw material vendors, and interface with supplier quality and procurement teams to meet material quality and vendor performance requirements.
• Develop new techniques, acceleration methods, tools, and quality screens to identify potential packaging quality and reliability problems early.
• Set reliability requirements to meet customer needs and influence design, material selection, and process development based on failure mechanisms.
• Lead efforts to innovate, problem‑solve, develop, and continuously improve equipment and processes using experimental design and statistical methods.
• Provide consultation on packaging problems and respond to customer/client requests or events as they occur.
• Deliver standardization in product qualification, manufacturing quality systems, and methods, and continuously engage with packaging technology development and partner engineering groups on process/technology maturity for products toward key risk areas.

• PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering discipline.
• 2+ years of prior experience combining engineering judgement and data analysis skills to draw conclusions, build models, and design experiments.
• Experience in materials science and engineering, and in material characterization techniques.
• Proficiency in design of experiments, statistical data analysis, and statistical process control.

• Working knowledge and/or prior experience in optics and lasers, laser micro‑machining, and micro‑fabrication.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary

Location:

US, Arizona, Phoenix

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual or