ATD MIHL Equipment Development Engineer
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-07-21
Listing for:
Intel Corporation
Full Time
position Listed on 2026-07-21
Job specializations:
-
Engineering
Process Engineer, Mechanical Engineer, Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
US, Arizona, Phoenix time type:
Full time posted on:
Posted Todaytime left to apply:
End Date:
July 28, 2026 (10 days left to apply) job requisition :
JR0285730#
** Job Details:**##
Job Description:
** The Role and Impact
** Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.
** Business group
** Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.
** Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer**- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets. - Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports. - Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows. - Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks. - Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges. - Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
- Lead problem-solving initiatives and drive continuous improvement in equipment and processes. - Provide expert consultation to internal teams and partners on packaging challenges and technical solutions. - Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.##
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* Qualifications:
** Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
** This position is not eligible for Intel immigration sponsorship.
**** Minimum Qualifications
*** Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.* **-OR
- ** Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.* **-OR
- ** PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
Relevant experience should include any of following: - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles. - Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
- Competency in mechanical design software such as Solid Works or AutoCAD.
** Preferred Qualifications** - Proven ability to lead technical innovation and manage complex, time-sensitive projects. - Understanding of semiconductor fabrication processes and packaging technologies. - Familiarity with supply chain management in a manufacturing or materials…
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