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ATD MIHL Equipment Development Engineer

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-07-21
Job specializations:
  • Engineering
    Process Engineer, Mechanical Engineer, Manufacturing Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 115110 - 188890 USD Yearly USD 115110.00 188890.00 YEAR
Job Description & How to Apply Below
## ATD MIHL Equipment Development Engineer Apply locations:
US, Arizona, Phoenix time type:
Full time posted on:
Posted Todaytime left to apply:
End Date:
July 28, 2026 (10 days left to apply) job requisition :
JR0285730#
** Job Details:**##

Job Description:

** The Role and Impact
** Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.

** Business group
** Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.

** Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer**- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.  - Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.  - Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.  

- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.  - Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.  - Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.  - Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.  

- Lead problem-solving initiatives and drive continuous improvement in equipment and processes.  - Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.  - Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.##
*
* Qualifications:

** Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
** This position is not eligible for Intel immigration sponsorship.
**** Minimum Qualifications
*** Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.* **-OR
- ** Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.* **-OR
- ** PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.

Relevant experience should include any of following:  - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.  - Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
- Competency in mechanical design software such as Solid Works or AutoCAD.

** Preferred Qualifications**  - Proven ability to lead technical innovation and manage complex, time-sensitive projects.  - Understanding of semiconductor fabrication processes and packaging technologies.  - Familiarity with supply chain management in a manufacturing or materials…
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