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Substrate Packaging R&D Engineer — Innovation & Reliability

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: PVH (Tommy Hilfiger/Calvin Klein)
Full Time position
Listed on 2026-07-21
Job specializations:
  • Engineering
    Manufacturing Engineer, Packaging Engineer, Quality Engineering, Process Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 180000 USD Yearly USD 120000.00 180000.00 YEAR
Job Description & How to Apply Below

Intel is seeking a Substrate Packaging Research and Development Engineer to join our Packaging Technology Development organization in Arizona. You will develop assembly processes and equipment, optimize manufacturing efficiency, and document improvements through experiments and white papers.

You will lead reliability and process development for future packaging technologies, collaborating with supplier quality and engineering teams to meet performance, cost, and manufacturability targets.

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