Packaging Module Equipment Development Engineer

Advanced Packaging Technology Manufacturing Division

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:

• Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms.
• Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovating next generation equipment, materials and fabrication processes to enhance semiconductor packaging capabilities at scale.
• Managing projects to meet product development timelines.
• Applying formal education and judgment to solve technical problems.
• Providing sustaining support for equipment performance and process health in high-volume manufacturing.
• Responding promptly to foundry customer requests and events.

The ideal candidate will demonstrate:

• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.

This position requires regular onsite presence.

Primary

Location:

US, Arizona, Phoenix

Additional Locations: