Module Engineer: Semiconductor Packaging Innovator
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-07-25
Listing for:
Intel Corporation
Full Time
position Listed on 2026-07-25
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer, Quality Engineering -
Manufacturing / Production
Packaging Engineer, Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
Intel Corporation in Phoenix, AZ is seeking a Module Engineer to design and optimize assembly processes for next-generation foundry packaging. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for foundry customers.
The role emphasizes DOE-based process development, reliability screening, and continuous improvement, with a day shift schedule (Shift
7) and on-site work.
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