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Senior Hybrid Bonding Engineer – Die-to-Wafer Innovation
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-08-03
Listing for:
TalentAlly
Full Time
position Listed on 2026-08-03
Job specializations:
-
Engineering
Systems Engineer
Job Description & How to Apply Below
Intel is seeking a Senior HBI Module Development Engineer to drive die-to-wafer hybrid bonding program development and manufacturability for next‑gen packaging. You will advance FOK platforms, optimize processes, and collaborate across development and manufacturing teams to improve yield, reliability, and throughput.
You will contribute to technology roadmaps, perform DOE studies, and mentor engineers, helping shape Intel's hybrid bonding roadmap for high-performance computing and chiplet
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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