Packaging Module Development Engineer: Innovate & Optimize
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-08-22
Listing for:
Intel
Full Time
position Listed on 2026-08-22
Job specializations:
-
Engineering
Packaging Engineer, Quality Engineering, Process Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Intel’s Packaging Module Development team seeks a Packaging Module Development Engineer to design and optimize processes and equipment for next‑gen packaging solutions. You will drive DOE studies, reliability benchmarking, and manufacturability improvements to boost efficiency and product quality.
You will collaborate with cross‑functional teams to align with roadmaps, lead technical investigations, and implement innovative quality screens to address packaging challenges across Intel’s
#J-18808-LjbffrTo View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×