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Senior Packaging Module Engineer – Dielectrics & DOE
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-08-30
Listing for:
Able Too Work
Full Time
position Listed on 2026-08-30
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer -
Manufacturing / Production
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Intel is seeking a Packaging Module Development Engineer in the US (Phoenix, AZ) to advance assembly and packaging technologies. You will develop processes, equipment, and materials to enable next-generation packaging solutions, impacting manufacturing efficiency and product quality.
The role involves leading experiments, collaborating across teams, and driving continuous improvement to scale capabilities while meeting product development schedules.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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