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Director of Power Packaging Engineering; SiP​/WLP

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Renesas
Full Time position
Listed on 2026-09-02
Job specializations:
  • Engineering
    Packaging Engineer
Salary/Wage Range or Industry Benchmark: 180000 - 240000 USD Yearly USD 180000.00 240000.00 YEAR
Job Description & How to Apply Below
Position: Director of Power Packaging Engineering (SiP/WLP)

Renesas is seeking a seasoned packaging engineer to lead Package Technology Development/NPI and R&D for AI/datacenter power packaging, including Smart Power Stages, vertical power stages and power modules. The role focuses on wafer‑level, flip‑chip and multi‑chip module concepts with OSAT/CM coordination.

You will collaborate with Product, Quality and Operations to define processes, qualify new packages, and drive ramp‑up and production controls.

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